16/07/2026
On 7th July, 2026, the IEEE NSU Student Branch WIE Affinity Group successfully completed the webinar titled “3D Technology Overview, 3D Integration and Die Stacking”, which was held online via Zoom. The purpose of the session was to provide participants with insights into advanced semiconductor technologies, 3D integration and heterogeneous integration solutions that are driving the future of AI hardware and computing systems. Dr. Celia Shahnaz, Professor, Dept. of EEE, BUET, and Chair, IEEE WIE Committee 2023-24, was also in attendance.
The event began with a warm welcome from the host, who briefly introduced the purpose of the session, before inviting the speaker, Dr. Mukta G. Farooq, an IEEE Fellow and IBM Distinguished Research Scientist, to take the floor. The speaker began her presentation with an introduction to Artificial Intelligence (AI) and High-Performance Computing (HPC), highlighting the growing hardware demands required to support modern AI applications. She then discussed advanced packaging technologies and introduced the concept of chiplets, explaining their importance in system optimization, cost efficiency, and overall performance. Moving forward, Dr. Farooq provided an overview of 3D integration for AI systems and discussed various design considerations. She elaborated on heterogeneous integration approaches, silicon interposers, and the middle-process method of 3D integration before introducing Through Silicon Via (TSV) technology and its key process considerations. Through practical examples and case studies, she demonstrated how 3D stacking enables high bandwidth, low latency and energy-efficient access to memory without compromising functionality. Concluding her presentation, Dr. Farooq emphasized that the increasing demands of AI workloads are accelerating the adoption of heterogeneous integration solutions and highlighted the advantages of 3D integration in achieving compact, high-performance and energy-efficient computing systems. She also expressed her gratitude to all those who contributed to making the session possible.
An interactive Q&A session followed the speaker’s presentation, during which participants had the opportunity to ask questions and engage in discussion. Afterward, the host presented a virtual token of appreciation to Dr. Mukta G. Farooq on behalf of the IEEE NSU Student Branch WIE Affinity Group. The Session Chair and Faculty Advisor, Ms. Reeshoon Sayera, then delivered the closing remarks, thanking the speaker and participants and encouraging everyone to continue learning and exploring new technologies. Following this, Dr. Celia Shahnaz briefly spoke about WIE Day 2026 and introduced several accomplished former students currently working as professionals in the USA. Finally, the event ended with a group screenshot.